BEM / MRM 2013
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35th International Conference on Boundary Elements and Other Mesh Reduction Methods

 

11 - 13 June, 2013

New Forest, UK

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 Abstract and Paper Submission Information

Papers are invited on the topics outlined and others falling within the scope of the meeting. Abstracts of no more than 300 words should be submitted as soon as possible. Abstracts should clearly state the purpose, results and conclusions of the work to be described in the final paper.

We strongly encourage the submission of abstracts electronically, by clicking on the 'Submit an Abstract' button found at the top and bottom of this page. If you prefer, abstracts can be sent by email, fax or mail to the Conference Secretariat. Details can be found on the left side of this page. Please include your name, full address and conference topic on all submissions.

Final acceptance will be based on the full-length paper, which if accepted for publication, must be presented at the conference. The language of the conference will be English.

The paper deadline will be advised after submission of abstracts.

 



 

Organisers

jos_logo.jpg Wessex Institute of Technology, UK
University of Mississippi, USA

Sponsors

jos_logo.jpg WIT Transactions on Modelling and Simulation
International Journal of Engineering Analysis with Boundary Elements (EABE)

Conference Secretariat

Genna West
Wessex Institute of Technology
Ashurst Lodge, Ashurst
Southampton, SO40 7AA
Tel: 44 (0) 238 029 3223
Fax: 44 (0) 238 029 2853
gwest@wessex.ac.uk

Display Facilities

There will be space for organisations to display products, services and literature related to the theme of the conference. Further details are available from the Conference Secretariat above.

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Conference Chairmen

C A Brebbia
Wessex Institute of Technology, UK

A H D Cheng
University of Mississippi, USA

International Scientific Advisory Committee

D E Beskos
University of Patras, Greece

J T Chen
National Taiwan Ocean University, Taiwan

W Chen
Hohai University, China

G De Mey
University of Ghent, Belgium

P Dineva

Bulgarian Academy of Sciences, Bulgaria

E Divo

Daytona State College, USA

N Dumont
PUC-Rio, Brazil

O van Estorff
Hamburg University of Technology, Germany

X-W Gao
Dalian University of Technology, China

L Gaul
University of Stuttgart, Germany

L Godinho
University of Coimbra, Portugal

Y C Hon
City University of Hong Kong

M S Ingber
University of Colorado at Denver, USA

D B Ingham
University of Leeds, UK

A Karageorghis
University of Cyprus

A J Kassab
University of Central Florida, USA

J T Katsikadelis
National Technical University of Athens, Greece

M Kindelan-Segura
Universidad Carlos III de Madrid, Spain

V M A Leitao
Instituto Superior Tecnico, Portugal

E Leonel
University of S. Paulo, Brazil

D Lesnic
University of Leeds, UK

L Ling
Hong Kong Baptist University, Hong Kong

A Mammoli
University of New Mexico, USA

G D Manolis
Aristotle University of Thessaloniki, Greece

W J Mansur
Federal University of Rio de Janeiro, Brazil

L Marin
Romanian Academy, Romania

T Matsumoto
Nagoya University, Japan

AJ Nowak
Silesian University of Technology, Poland

L Palermo
University of Campinas, Brazil

E Pan
The University of Akron, USA

J B Pavia

University of São Paulo, Brazil

D Poljak
University of Split, Croatia

V Popov
Wessex Institute of Technology, UK

H Power
University of Nottingham, UK

C Pozrikidis

University of Massachusetts, USA

Q Qinghua
Australian National University, Australia

J Ravnik

University of Maribor, Slovenia

J Rencis
Tennessee Technological University, USA

T J Rudolphi
Iowa State University, USA

E Schnack
Karlsruhe University, Germany

L Skerget
University of Maribor, Slovenia

V Sladek
Slovak Academy of Sciences, Slovakia

E Strelnikova
Ukrainian Academy of Sciences, Ukraine

S Syngellakis
Wessex Institute of Technology, UK

A Tadeu
University of Coimbra, Portugal

T Tran-Cong

University of Southern Queensland, Australia

J Trevelyan
Durham University, UK

T Wu
University of Kentucky, USA

Z Yao
Tsinghua University, Beijing, China

B Yeigh

SUNY Institute of Technology, USA